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Discover how packaging shapes the future of electronics. Subscribe now to our science blog newsletter and unlock exclusive insights into our research at Fraunhofer IZM. Delivered every three weeks.

From chiplets to hardware security: see how application-focused microelectronics research is reinventing tomorrow.

From left to right:
Alternatives to hazardous and environmentally harmful chemicals for processing in wafer level packaging
Non-Stop Power for Electric Mobility
From Lab to Car: Process Optimization for Automotive Chiplets

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Katja Arnhold, Fraunhofer IZM

Katja Arnhold

Katja Arnhold is editorially responsible for Fraunhofer IZM's RealIZM blog.

Katja has over 20 years of experience in corporate communications and B2B marketing. She has worked for two private weather service providers and for the world market leader in premium alcoholic beverages, among others. She studied communication and media sciences, business administration and psychology at the University of Leipzig, holds a master degree and is a member of the Leipzig Public Relations Students Association (LPRS).

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