Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more...
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Panel Level Packaging Consortium 2.0 – Moving to the Next Level
Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea...