Assessing costs and environmental impacts in packaging processes Mathilde Billaud works on cost and environmental models. Her mission: To optimize panel-level packaging at the process level. A packaging process...
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Dr. Mathilde Billaud
Marieke Lienert
Prof. Dr. Klaus-Dieter Lang
Dr.-Ing. Maik HampickeChallenges in Data Processing for IoT-Based Applications
Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality...
Malina Metzing
Panel Level Packaging Consortium 2.0 – Moving to the Next Level
Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea...
Dr. Tanja Braun
Dr. Michael Töpper