Dr. Olaf Wittler studied physics in Paderborn, Berlin, and London. He received his diploma degree in 1999 and Ph.D. in 2004 from the Technical University of Berlin. His work experience includes several positions at Robert Bosch GmbH, TU Berlin, and Fraunhofer IZM, where he currently holds a position as team leader and chief scientist for the reliability simulation of packaging technologies. He has authored and co-authored more than 100 conference and journal papers. He is actively involved in reviewing (CIPS / ESREF / ESTC), teaching (“Reliability of Electronic Systems” - TU Berlin) and association work (heading the “GMM FA 5.5 - Aufbau- und Verbindungstechnik”). In 2022, he will be co-chairing ESREF 2022 in Berlin. His current research interests include warpage prediction in FO-WLP, FO-PLP, and PCB-embedded packages, the reliability and ageing of RF packages and materials, advanced damage modelling in power electronics interconnection technologies, and the reliability of substrates and via technologies.
Communication networks like 5G need the many modules and components that make them up to be robust and long-lasting, whatever the environmental conditions or other circumstances may be. Researchers at Fraunhofer IZM have now developed a testing method which allows…
Driven by the digital and ecological transition, the term “eco-reliability” has gained increased popularity within the last years. The main objective of this article is to present this new approach from its complementary perspectives “ecology and reliability” and to highlight…
