Andreas Middendorf works as a business developer in the Business Development Team of the Fraunhofer Institute for Reliability and Microintegration (IZM).
He was working as a scientist in the department Environmental and Reliability Engineering of the Fraunhofer Institute for Reliability and Microintegration (IZM) and of the Technical University Berlin since May 1995. He was responsible for the development and implementation of methods and demonstrators for the estimation of lifetime for electronic appliances.
Further on he is investigating technological aspects that combine the electronics design with environmental engineering techniques. This includes environmental assessments through LCA and through other methods, especially for Eco-Design, the evaluation of recycling attributes, the development of databases and software as well as environmental oriented product evaluation.
He carried out courses on EcoDesign for electronic companies, holds four patents and has coordinated several cooperative research projects in Germany and Europe.
Since 2010 until 2015 he was senior manager for the application field automotive and transportation systems and in charge for the System Reliability and Measurement Group at IZM.
He studied electrical engineering at the Technical Universities of Aachen and Wuppertal where he specialized on information and communication technologies.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Labels Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication