Andreas Middendorf works as a business developer in the Business Development Team of the Fraunhofer Institute for Reliability and Microintegration (IZM).
He was working as a scientist in the department Environmental and Reliability Engineering of the Fraunhofer Institute for Reliability and Microintegration (IZM) and of the Technical University Berlin since May 1995. He was responsible for the development and implementation of methods and demonstrators for the estimation of lifetime for electronic appliances.
Further on he is investigating technological aspects that combine the electronics design with environmental engineering techniques. This includes environmental assessments through LCA and through other methods, especially for Eco-Design, the evaluation of recycling attributes, the development of databases and software as well as environmental oriented product evaluation.
He carried out courses on EcoDesign for electronic companies, holds four patents and has coordinated several cooperative research projects in Germany and Europe.
Since 2010 until 2015 he was senior manager for the application field automotive and transportation systems and in charge for the System Reliability and Measurement Group at IZM.
He studied electrical engineering at the Technical Universities of Aachen and Wuppertal where he specialized on information and communication technologies.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
