Dr. Michael Schiffer received his diploma in electrical engineering with focus on microsystems technology in 2003, and his doctorate degree with distinction for the development of a MEMS mass flow controller in 2010, both at the Technical University in Berlin. In 2009, he worked for TDK Sensors as a product developer for the MEMS pressure sensors, where he later headed process development and operations.
Since 2018 he worked at Fraunhofer IZM and since 2019 he has been the head of the department »Wafer Level System Integration« with around 50 employees. His particular interests are innovative 2.5D/3D system integration technologies and the further development of MEMS and electro-optical systems.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication