Oliver Kirsch completed his M.Sc. degree in applied physics at the Technical University of Berlin in 2017, studying deterministic quantum devices for quantum communication networks.
From 2017 to 2019, he worked as a test engineer at Sicoya GmbH, mainly focusing on the characterization of optical & DC/RF building blocks on chip level and DVT and compliance tests for high-speed transceivers on the PCBA and module levels.
He then joined Fraunhofer IZM until 2024 to conduct research into state-of-the-art fiber interconnect solutions and packaging methods as well as the potential of glass as a new platform for quantum photonic applications.
3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication