Wojciech Lewoczko-Adamczyk studied physics at the Jagiellonian University of Cracow (Poland) and received a doctoral degree from the Humboldt University in Berlin for his work on Bose-Einstein condensates in microgravity.
After post-doctoral work at the University of Amsterdam, he ook over a research position at the Ferdinand-Braun-Institute in Berlin before joining Fraunhofer IZM in 2016 as a researcher focusing on optical interconnections and photonic packaging.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
