Wojciech Lewoczko-Adamczyk studied physics at the Jagiellonian University of Cracow (Poland) and received a doctoral degree from the Humboldt University in Berlin for his work on Bose-Einstein condensates in microgravity.
After post-doctoral work at the University of Amsterdam, he ook over a research position at the Ferdinand-Braun-Institute in Berlin before joining Fraunhofer IZM in 2016 as a researcher focusing on optical interconnections and photonic packaging.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication