Thomas Fritsch, Fraunhofer IZM

Thomas Fritzsch

Thomas Fritzsch received the diploma degree (M.Sc.) in electrical engineering from the University Dresden, Germany, in 1997.

Since 2001 he has been with the Fraunhofer Institute for Reliability and Microintegration Berlin, Germany. He is head of the group BeOL-, TSV- and Bump-Metallization. He is working as R&D engineer and project manager in the field of advanced wafer level packaging solutions with focus on pixel detector and sensor packaging applications.