Semiconductors

In the business field of semiconductors at Fraunhofer IZM, the focus lies on the integration and the manufacture of sensors. 3D integration enables the realization of complex, heterogeneous System-in-Package solutions.

The major advantages of 3D system architecture include the high miniaturization and improved form factor. It also includes Improved performance and power efficiency. This is due to the faster signal speeds and higher bandwidth via shorter and narrower signal paths. 3D system architecture also increases functionality due to heterogeneous integration of components. Those components are fabricated using various technologies (sensor, memory, ASIC and transceiver).

Fraunhofer IZM’s services include a closed process chain – concept and process development and characterization. Additionally, reliability assessment and prototyping of 3D systems. Our labs provide all processes required throughout the chain for the realization of wafer-level packages. This includes silicon via (TSV) formation. Image sensors, sensor nodes and eGrains are some examples for various application scenarios. The realization and characterization of those 3D systems that meet the disparate target profiles is possible at Fraunhofer IZM.

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

Wafer-Level-Systemintegration auf 300mm – Kernkompetenz des Fraunhofer IZM-ASSID

Seit mehr als 10 Jahren betreibt das Zentrum „All Silicon System Integration Dresden – ASSID“ eine hochmoderne, industrietaugliche 200/300mm 3D-Wafer-Level-Prozesslinie mit Modulen für TSV-Bildung, Vormontage (Ausdünnen, Vereinzeln), Wafer-Level-Montage und Stapelbildung. Das ASSID ist Teil des Fraunhofer IZM. Und seine Philosophie…

Weltraumelektronik – Fit für den Orbit

Der Weltraumvertrag von 1967 regelt: „Jede Nation hat freien Zugang zum All.“ Seit zirka 20 Jahren starten immer mehr Nationen mit kommerziellen Projekten in den Weltraum. Private Raumfahrtunternehmen planen, mit Mikro– und Nanosatelliten z.B. die weltweite lückenlose Internetversorgung zu erreichen….

Space Electronics – Fit for Orbit!

The Outer Space Treaty of 1967 stipulates that every nation enjoys free access to space. For the last 20 years, more and more nations have been launching commercial projects in space. Private spaceflight companies are planning to use micro and…

From Idea To Product Sample in one Year – The Philosophy of Fraunhofer IZM-ASSID

Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) is a dedicated business unit of Fraunhofer IZM located in Dresden/Moritzburg, Saxony. With its 300 mm wafer-level packaging process line, its mission is to develop custom system integration technologies for industrial partners, with…

HOW TO TEST ELECTRONIC PRODUCTS FOR THE REAL WORLD? DESIGN FOR RELIABILITY

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

POWER ELECTRONICS – CONVERTING CURRENTS THE MODERN WAY

Power electronics systems have to shoulder a heavy burden in terms of what is required of them and what they are expected to deliver. At Fraunhofer IZM, Stefan Hoffmann is working hard on new designs for passive and magnetic components…