Dominik Seidenstücker completed his master's degree in mechatronics at the Beuth University of Applied Sciences Berlin, graduating with a Master of Engineering in December 2020. While still a student, he gained practical experience at IAV GmbH in Berlin, where he spent two years in development and application roles. This period shaped his strong interest in innovative vehicle technology and laid the foundation for his current career.
In 2021, he joined the »Power Electronics« department of Fraunhofer IZM as a research assistant where he works on developing highly integrated inverters and on-board chargers for automotive applications. His responsibilities include project management in its full range - from project management, conceptual development, and design to coordinating production processes and commissioning and optimizing systems. One particular focus of his is the integration of modern semiconductor technologies and transformers into printed circuit board technologies as a way to create compact and efficient solutions.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication
