Dr. Vitalij Scenev graduated from Humboldt University Berlin with a Diploma in Experimental Physics in 2009, followed by a PhD in 2014. He joined PAS Deutschland GmbH in 2015 to contribute to the development of smart Human-Machine Interfaces for home appliances before moving to the Technical University of Berlin’s Department of System Integration and Interconnects in 2019. He holds several German and European patents in the field of flexible printed electronics.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
