Ulf Oestermann studied Microsystems Engineering at FHTW Berlin – University of Applied Science. Since 2005 he works at the Fraunhofer Institute for Reliability and Microintegration IZM.

His research and work focus is on project acquisition/lead/handling in the domain of mounting and connection technology, surface mount technology and medical engineering. Furthermore, he is in charge of the complete organization and hosting of the joint stand “Future Packaging” at the annual international trade-show “SMT connect”.

Since 2017 he is also responsible for the institute’s business development activities and took over the realization and operation of Fraunhofer IZMs special research/lab/work infrastructure for prototyping - “Start-A-Factory”. Here, he actively supports hardware startups from their first draft to a working, industrial grade prototype and also maintains a network of tool suppliers and other partners.