Dr. Max Marwede is Research Fellow at the Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM) and holds a PostDoc position in the Junior Research Group „Obsolescence as a challenge for sustainability – causes and alternatives“ at the Technical University Berlin. As a PostDoc he develops an eco-innovation process for long-living products.
As part of the department “Environmental and Reliability Engineering” of the Fraunhofer IZM and as a freelancer he supports companies in designing sustainable products and consults German and European public authorities on future eco-design requirements.
He has experience with technology roadmapping, interdisciplinary stakeholder cooperation and project management in industry-oriented research projects in various technology fields (automation technologies, renewable energies and electronics). Part of his work is to facilitate and moderate eco-innovation processes and train engineers and designers how to develop sustainable products. For the latter, Max created the Learning Factory Ecodesign together with Tapani Jokinen.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication