Julia Günther-Sorge studied electrical engineering at the Technical University of Berlin and was a research assistant at the Fraunhofer Institute for Reliability and Microintegration IZM in the sensor nodes & embedded microsystems group from 2010 till 2014.
Since 2014 she is a research assistant at the Technical University of Berlin in the Packaging and Interconnection Technology Department with a focus on microperipheric technologies. In addition, she gives lectures for bachelor students on project-oriented internships (Project Laboratory) in electrical engineering.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
