Julia Günther-Sorge studied electrical engineering at the Technical University of Berlin and was a research assistant at the Fraunhofer Institute for Reliability and Microintegration IZM in the sensor nodes & embedded microsystems group from 2010 till 2014.
Since 2014 she is a research assistant at the Technical University of Berlin in the Packaging and Interconnection Technology Department with a focus on microperipheric technologies. In addition, she gives lectures for bachelor students on project-oriented internships (Project Laboratory) in electrical engineering.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication