After training as a physics laboratory assistant, Steve Voges studied physical engineering at what is now the Berlin University of Applied Sciences. He worked as a student assistant at Fraunhofer IZM for more than two years, specializing in thermocompression bonding. After successfully completing his studies, he spent ten years at the Technical University of Berlin, working in cooperation with Fraunhofer IZM in the field of electronic packaging on organic substrates.

Since January 2019, Steve Voges has been working at Fraunhofer IZM in the »Assembly & Encapsulation Technologies« working group, while also studying computer science. His core competencies include advanced packaging, in particular component assembly, data preparation, and process digitization.