Dr. Ndip has been with the Fraunhofer Institute for Reliability and Microintegration IZM for almost two decades and has been heading the Institute’s RF and Smart Sensor Systems operations since 2014.
Alongside his work at the Institute, he is a lecturer at the TU Berlin’s electrical engineering and computer science department, where he was also awarded his doctorate with “summa cum laude” honors. He completed his post-doctorate habilitation at the BTU Cottbus-Senftenberg.
Dr. Ndip contributed substantially to the development of hardware components and modules for 5G millimeter waves. He is a renowned expert for everything concerning antenna and high frequency systems for wireless communication and sensor technology.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication