Carsten Brockmann studied technical computer science at the Technical University of Berlin (TUB) and graduated with a degree in engineering in 2008. He then worked as a research assistant in the section for wireless sensor systems at the TUB's Research Center for Microperipheric Technologies until moving to the Fraunhofer Institute for Reliability and Microintegration IZM in 2014. There he continued his research activities within numerous projects in the field of embedded systems and took over as head of the »Sensor Nodes and Embedded Microsystems« group in 2015.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
