Carsten Brockmann studied technical computer science at the Technical University of Berlin (TUB) and graduated with a degree in engineering in 2008. He then worked as a research assistant in the section for wireless sensor systems at the TUB's Research Center for Microperipheric Technologies until moving to the Fraunhofer Institute for Reliability and Microintegration IZM in 2014. There he continued his research activities within numerous projects in the field of embedded systems and took over as head of the »Sensor Nodes and Embedded Microsystems« group in 2015.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting European Green Deal Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication