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Dr. Joshua Wilson is a research scientist at Fraunhofer IZM, where he has spent his time since 2020 on developing scalable microfabrication, assembly, and packaging processes for soft neural implants. He is responsible for running the »Technologies for Bioelectronics« lab, applying for grants for EU projects, and fostering partnerships with industry. Prior to Fraunhofer IZM, he was a research associate at the University of Manchester from 2018 to 2019, focusing on low-voltage thin-film transistors that use oxide semiconductors. He holds a PhD in nanoscience from the University of Manchester, where he explored Schottky junctions in thin-film electronic devices. He completed his Master degree in mathematics with First Class Honours at the University of Nottingham.
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3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication