M.Sc. Eduard Wagner joined Fraunhofer IZM in 2013, in the »Environmental and Reliability Engineering« department’s research group on »Sustainable Networks and Computing« with its special focus on digitization and sustainability. In his work, he explores whether and how data from the product life cycle can be used to improve product circularity and sustainability.
He has led and contributed to various flagship projects related to the digital product passport (or DPP), and continues to do so in his current work: in the EU project »CIRPASS 2«, he worked on evaluating the environmental and circularity impact of the DPP, in the EU CSA project »CIRPASS« on developing a data infrastructure for European DPPs, in the UBA project »Product Information 4.0« on identifying gaps in current legal information, in the »PACT NEW3« project on pinpointing the manufacturing data relevant for DPPs as well as industry projects dedicated to requirements specific to a sector or product group.
Currently, he is co-developing the DPP-specific ecodesign requirements as part of the preparatory studies for the EU’s delegated acts. In another projects(EU Horizon Europe »INCREACE«), he is in charge of the work package on »Circular product design« with a special focus on the recyclability of plastics in WEEE collection.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication