Professor Juliana Panchenko works as a group leader in the »Micro-Nano Interconnect« unit of the »Wafer-Level System Integration« department at Fraunhofer IZM-ASSID. She is also an honorary professor at the Technical University of Dresden.
She studied microelectronics at the National Technical University of Ukraine in Kyiv, including a period abroad at the Technical University of Dresden. In her master's thesis, she researched the microstructure of lead-free materials. She began her postgraduate career as a research assistant and doctoral candidate at the Institute of Electronic Packaging Technology (IAVT) at TU Dresden, where she completed her doctorate in 2013. After her successful period as junior professor from July 2014 onwards, she was appointed as an honorary professor for »Nanomaterials for Electronics Packaging« at the IAVT.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication