Dr. Andreas Ostmann | © Fraunhofer IZM

Dr. Andreas Ostmann

Dr. Andreas Ostmann heads the System Integration and Interconnect Technologies department at Fraunhofer IZM. For more than 25 years, he and his working group have been dedicated to embedding electronic components in printed circuit boards. The technologies they have developed are now used worldwide, including processes for chemical metallization of flip chip dies. He studied applied semiconductor physics at the Technical University of Berlin and completed his doctorate in microsystems technology.