Dr. Johannes Jaeschke has headed the System Reliability Assessment group in the Environmental and Reliability Engineering department at Fraunhofer IZM since 2015. After studying electrical engineering at the Technical University of Berlin, he earned his doctorate in 2012 with a thesis on the failure mechanism of electromigration in solder joints.
His research focuses on the reliability management of electronic (micro) systems and their application-specific condition assessment using digital twins for a sustainable circular economy. He also supervises bachelor's, master's, and doctoral theses at Fraunhofer IZM and at the TMP research center at the Technical University of Berlin. As a lecturer at the TU Berlin, he teaches students the methodological basics and application perspectives of reliability assessment for electronic systems.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication
