Dr. Johannes Jaeschke has headed the System Reliability Assessment group in the Environmental and Reliability Engineering department at Fraunhofer IZM since 2015. After studying electrical engineering at the Technical University of Berlin, he earned his doctorate in 2012 with a thesis on the failure mechanism of electromigration in solder joints.
His research focuses on the reliability management of electronic (micro) systems and their application-specific condition assessment using digital twins for a sustainable circular economy. He also supervises bachelor's, master's, and doctoral theses at Fraunhofer IZM and at the TMP research center at the Technical University of Berlin. As a lecturer at the TU Berlin, he teaches students the methodological basics and application perspectives of reliability assessment for electronic systems.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
