Sorry, there are no posts found on this page. Feel free to contact website administrator regarding this issue.
Andreas Brüning studied electrical engineering/communications engineering at Kiel University of Applied Sciences. In his career, he has worked as a development engineer at Philips Semiconductors/NXP, as Head of the Engineering Support Center at sci-worx GmbH and as Director Technology Office at ZMD AG with a focus on analog design methodology, physical realization, design flow, and test engineering.
He later headed the Efficient Electronics department and was Chief Engineer at the Fraunhofer Institute for Integrated Circuits IIS, Adaptive Systems Engineering branch EAS. Since 2008, he has been active in the Silicon Saxony e.V. association, initially many years as Head of the IC Design working group and, since 2015, on the scientific advisory board. Since 2023, he has been a senior expert for the design of microelectronic systems at the Research Fab Microelectronics Germany (FMD).
Sorry, there are no posts found on this page. Feel free to contact website administrator regarding this issue.
3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication