Hermann Oppermann received his PhD in Materials Science from the Metals Research Institute at the Technical University of Berlin. From 1993 to 1999 he worked at the university’s Research Center for Microperipheric Technologies, focusing on flip-chip and CSP packaging technology.
In 1999 he joined Fraunhofer IZM where he has been leading the group »Fine Pitch Assembly and Interconnects«. His research contributions include flip chip, die attach and wafer level packaging technologies for MEMS, RF, opto, and power applications. He has been instrumental in advancing AuSn soldering for die bonding and flip-chip applications, as well as in developing transient liquid phase bonding and nanoporous gold bonding.
In 2024 he was awarded the Deutscher Zukunftspreis – the German Federal President's Prize for Technology and Innovation – for the project »Digital Light«.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wire bonding Wireless Communication
