Hermann Oppermann | © Deutscher Zukunftspreis | Ansgar Pudenz

Dr.-Ing. Hermann Oppermann

Hermann Oppermann received his PhD in Materials Science from the Metals Research Institute at the Technical University of Berlin. From 1993 to 1999 he worked at the university’s Research Center for Microperipheric Technologies, focusing on flip-chip and CSP packaging technology.

In 1999 he joined Fraunhofer IZM where he has been leading the group »Fine Pitch Assembly and Interconnects«. His research contributions include flip chip, die attach and wafer level packaging technologies for MEMS, RF, opto, and power applications. He has been instrumental in advancing AuSn soldering for die bonding and flip-chip applications, as well as in developing transient liquid phase bonding and nanoporous gold bonding.

In 2024 he was awarded the Deutscher Zukunftspreis – the German Federal President's Prize for Technology and Innovation – for the project »Digital Light«.