Steffen Bickel | © Fraunhofer IZM-ASSID

Steffen Bickel

Steffen Bickel studied materials science and earned his doctorate in the packaging technology of high-density contacts. He has been working at Fraunhofer IZM-ASSID since 2021, where his research focuses on fine-pitch interconnection technologies and wafer-level packaging for quantum computing applications. In addition, he coordinates Fraunhofer IZM-ASSID's technological activities for the construction of the APECS pilot line.