Pierre Wolter completed his Master of Fine Arts at Central Saint Martins College of Art and Design in London, where his focus on media art, video art, performance, and media installation took shape.
In 2006 he co-founded the »Art Claims Impulse« gallery in Berlin, which specializes in video, performance, and multimedia art and champions works that take an unconventional approach – innovative in content, technique, or aesthetics – and stimulate discourse; he has also been working as a curator since 2007. Through its »Art x Science« platform, the gallery is dedicated to the intersection of art and science, supporting artists who explore scientific ideas and methods as integral components of their creative processes.
As curator of »Somatic Circuits«, Pierre Wolter works with media artist Marlot Meyer and the »Technologies of Bioelectronics« research group at Fraunhofer IZM on an interactive artwork that turns communication via biological signals into a physical and aesthetic experience. Rather than presenting technology from a single perspective, the project creates a shared exploration of bioelectronics through both scientific and artistic practice.
3D-Integration 3D-Printing 5G 6G Antenna Artificial Intelligence Autonomous Driving Battery Technology Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Data Centers Digital Twin E-Textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels Flip-Chip Hardware Security Heterogeneous Integration High Performance Computing ICT Industry 4.0 Internet of Things Life Cycle Assessment Low Power Machine Learning Material Analysis Medical Technology Modular Electronics Neuromorphic Computing Panel-Level Packaging Photonic Integrated Circuits Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Smart Textiles Sustainable Electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer-Level Capping Wafer-Level Packaging (WLP) Wire bonding Wireless Communication
