Industrial Electronics

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

CHALLENGES IN DATA PROCESSING FOR IOT-BASED APPLICATIONS

Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality, unprecedented numbers of devices and machines have…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

THE GLASSY FUTURE OF CIRCUIT BOARDS

It’s an understatement to say that a lot has changed in microelectronics in the last fifty years – and the same goes for circuit boards.  But even greater changes are afoot: with ever more data being used and shared, electrical…

LOW POWER AND COMMUNICATIVE MICROSYSTEMS: TURNKEY SOLUTION FOR INDUSTRY

In factories, cars, agriculture, medicine – microsystems are used everywhere. Julia Günther-Sorge, a researcher on microperipheric technologies at the Technical University of Berlin and member of the Sensor Nodes & Embedded Microsystems group working in cooperation with Fraunhofer IZM, has…