Industrial Electronics

THE ADVANTAGES OF COST MODELLING IN PACKAGING PROCESSES

Assessing costs and environmental impacts in packaging processes   Mathilde Billaud works on cost and environmental models. Her mission: To optimize panel-level packaging at the process level. A packaging process optimized already at the R&D stage has many benefits to…

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

CHALLENGES IN DATA PROCESSING FOR IOT-BASED APPLICATIONS

Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality, unprecedented numbers of devices and machines have…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…