Medical Engineering

Medical-engineering is one of the core competences at Fraunhofer IZM. Medical technology will continue to have significant impact on the quality of life in our modern civilization. The adoption of electronics and microtechnology has had tremendous impact on previously uncurable diseases. Also it influences the autonomy of patients and promises improvements for future treatment and diagnosis.

Neural trauma, chronic diseases and pain treatment count as main topics. Novel diagnostic concepts allow faster detection of the diseases‘ origin and faster development of new pharmaceutical agents. For more than a decade Fraunhofer IZM has served the medical industry with its technology portfolio adapted to heart pace makers, to retinal implants, to lab-on-chip platforms, to neuroprosthetic devices and hearing aids. We act as a one-stop-shop solution provider for customers from research and industry in search for miniaturized integration of microelectronic, microsensory, microfluidic and micro-optical systems.

HOW TO TEST ELECTRONIC PRODUCTS FOR THE REAL WORLD? DESIGN FOR RELIABILITY

Tom Dobs is an expert for the reliability of electronic systems at Fraunhofer IZM. In the video, he introduces different methods for testing and optimizing products concerning their reliability. Vibration measurement and test with electronic components, if required in combination…

ECO-RELIABILITY: THE NEW APPROACH TOWARDS SUSTAINABLE AND RELIABLE ELECTRONICS

Driven by the digital and ecological transition, the term “eco-reliability” has gained increased popularity within the last years. The main objective of this article is to present this new approach from its complementary perspectives “ecology and reliability” and to highlight…

IZM’S IN, DIRT’S OUT: HOW TO WASH YOUR E-TEXTILES

E-Textiles have been under development for almost two decades, but still have not reached a wide market. One of the reasons is their deficient usability which leads to a low user acceptance. Especially for textile-integrated conductor tracks, which exhibit a…

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…