Manuel Bäuscher studied electrical engineering at THM Mittelhessen in Friedberg, Hessen for his Bachelor’s degree. In 2019 he finished his Master’s degree at TU Berlin with the focus on microsystem technologies.
Since 2016, he worked as research assistant at Fraunhofer IZM and since April 2019 as research associate in the research group microsensors at the department Wafer Level System Integration.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Indoor Positioning Systems Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Capping Wafer Level Packaging Wireless Communication