Information & Communication

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

CHALLENGES IN DATA PROCESSING FOR IOT-BASED APPLICATIONS

Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality, unprecedented numbers of devices and machines have…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…

CIRCULAR ECONOMY – A MORE SUSTAINABLE JOURNEY FOR ELECTRONIC DEVICES

When we think of the journey of electronic products, most of us are probably thinking about the journey that our new washing machine takes from the shop and worrying about getting it up the stairs and into our flat. Very…

THE FUTURE OF TECHNOLOGY IN YOUR EAR – ‘HEARABLE LABS’

RealIZM meets Pauline O’Callaghan, the CEO of ‘Hearable Labs’, a start-up developing futuristic technologies that will live inside your ear. RealIZM: Tell us about Hearable Labs. Pauline O’Callaghan: I should start by telling you what hearables are: generally, they’re true…