Automotive/Transportation

Automotive/Transportation – Core competence at Fraunhofer IZM

The application areas automotive and transportation technologies are core competences of Fraunhofer IZM since it’s establishment. Automotive driving and new ways of transportation, especially in urban areas, are hot topics all over the industry. The institute has worked with OEMs, tier 1s and, in particular, their suppliers.

Fraunhofer IZM intends to “electronify” the automobile at all levels. We develop innovative, cost-efficient and reliable solutions. This includes the prototype level, for conventional, hybrid and electric drive engineering and safety and comfort systems. 

The field of application consists of different competences: Sensor and actuator technology, Power electronics, Reliability management and assurance and Robust design.

Automotive/Transportation – core competence at Fraunhofer IZM

Threats and protection mechanisms for the trustworthiness of electronic hardware

RealIZM blog series “Hardware security” – Part 1 With increasing globalization and more complex supply chains, electronic hardware is also becoming more susceptible to manipulation. Jan Hefer, a member of the RF & Smart Sensor Systems department, is working hard…

Electrification in the fast lane: How silicon carbide is driving power electronics forward

The new generations of semiconductors with a wider band gap (WBG), such as silicon carbide (SiC), have the potential to put electric mobility in the fast lane. This is because they yield significantly higher efficiency compared to conventional silicon IGBT…

Pioneering tomorrow’s microelectronics: from chiplet integration to cooling – challenges in high-end performance packaging

The future of microelectronics faces exciting developments and important trends. But how will this technological sector develop in the coming years? Which application areas will significantly drive 2.5D/3D hetero-integration and high-end performance packaging, and where are the limits of what…

Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras

Finding a way to make the production of thermal infrared sensors cheaper would open up numerous new possibilities for thermal imaging systems e.g. for automotive and security applications. This is why Fraunhofer IZM researchers have been working on wafer-level packaging…

How do you develop the best radar systems in the world for the application in question?

Creating the best radar systems in the world for the application in question is an ambitious undertaking, But Dr. Christian Tschoban and Paul Perlwitz from Fraunhofer IZM are working on nothing short of that goal: The two scientists have developed…

High speed with optical signals: Will the printed circuit board of the future be made of glass?

The backbone of our digital world is made of glass: A network of optical fibers spans the globe and lets data criss-cross our globe. We also experience the digital world through a pane of glass: We interact with the online…

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

Adhesive-free fused silica fiber joints made possible by direct laser welding

Fused silica may be expensive and complicated to produce, but the laser welding process developed at Fraunhofer IZM, which uses it as a connection for photonic chips, is something of a revolution. Welding with a CO2 laser enables robust and…

Space Electronics – Fit for Orbit!

The Outer Space Treaty of 1967 stipulates that every nation enjoys free access to space. For the last 20 years, more and more nations have been launching commercial projects in space. Private spaceflight companies are planning to use micro and…

A Pedestrian Or Just A Beverage Can? Helping Self-Driving Cars Recognize Objects With Cameras and Radars Combined

Autonomous driving is getting better with every technological advance. But for driverless cars to become truly safe in traffic, they need a sensor system that recognises objects in the street – reliably and with no margin for error. Christian Tschoban…