Information & Communication

Information and Communication technology faces new challenges, because of the new era of increasing connectivity and digitalization. The efficient sharing and storing of data needs ever larger data centers and the means to transmit electric and optical signals. Digitalization itself brings its own challenges: There is increasing demand for highly dynamic networks that can transport, process, and analyze data.

Fraunhofer IZM can offer solutions for these challenges because of more than two decades of experience in the field of system integration.

Fraunhofer Designintegrated, miniaturized, autonomous, and robust sensor systems and wireless networks and constructs high-frequency systems and electro-optical components. The provided services also include the Optimization of processes and transfer of construction technologies for highly integrated systemsReliability testing and service life forecasting and Consulting and eco-design services for sustainable ICT products 

ECO-RELIABILITY: THE NEW APPROACH TOWARDS SUSTAINABLE AND RELIABLE ELECTRONICS

Driven by the digital and ecological transition, the term “eco-reliability” has gained increased popularity within the last years. The main objective of this article is to present this new approach from its complementary perspectives “ecology and reliability” and to highlight…

HOW PANEL AND WAFER-LEVEL PACKAGING BOOSTS SYSTEM INTEGRATION FOR DIGITAL NETWORKING

Progressive digitalization driven by advanced assembly and packaging Digitalization is happening right now in almost all areas of our world. With increasing numbers of end products getting connected, more and more custom systems are required to run them – with…

CHALLENGES IN DATA PROCESSING FOR IOT-BASED APPLICATIONS

Malina Metzing spends her working days in a very exclusive position: a software developer at the generally hardware-oriented Fraunhofer IZM. As the vision of the Internet of Things is steadily becoming a reality, unprecedented numbers of devices and machines have…

PANEL LEVEL PACKAGING CONSORTIUM 2.0 – MOVING TO THE NEXT LEVEL

Electronic packaging stands on the cusp of a new wave of innovation, propelled by recent progress with autonomous cars and mobile consumer electronics. A group of industry leaders from Europe, the US, Japan, and Korea has assembled to put in…