Information & Communication Technology

Information and communication technology faces new challenges, because of the new era of increasing connectivity and digitalization. The efficient sharing and storing of data need ever larger data centers and the means to transmit electric and optical signals. Digitalization itself brings its own challenges: There is increasing demand for highly dynamic networks that can transport, process, and analyze data.

Fraunhofer designintegrated, miniaturized, autonomous, and robust sensor systems and wireless networks and constructs high-frequency systems and electro-optical components. The provided services also include the optimization of processes and transfer of construction technologies for highly integrated systems, reliability testing and service life forecasting and consulting and eco-design services for sustainable ICT products 

Wafer-level system integration on 300mm – The core competence of Fraunhofer IZM-ASSID

For more than 10 years, the “All Silicon System Integration Dresden – ASSID” center has been operating a state-of-the-art, industry-grade 200/300mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, separation), wafer-level assembly, and stack formation. The ASSID…

Wafer-Level-Systemintegration auf 300mm – Kernkompetenz des Fraunhofer IZM-ASSID

Seit mehr als 10 Jahren betreibt das Zentrum „All Silicon System Integration Dresden – ASSID“ eine hochmoderne, industrietaugliche 200/300mm 3D-Wafer-Level-Prozesslinie mit Modulen für TSV-Bildung, Vormontage (Ausdünnen, Vereinzeln), Wafer-Level-Montage und Stapelbildung. Das ASSID ist Teil des Fraunhofer IZM. Und seine Philosophie…

Nachhaltige mobile IT-Geräte für die Umwelt: Lang lebe das Smartphone und Tablet!

Die Themen Nachhaltigkeit und mobile IT-Geräte gewinnen immer mehr an Bedeutung. Sowohl bei der Produktion als auch bei der Nutzung von Smartphones, Tablets und Co. entstehen CO2-Emissionen. Hinzu kommt, dass bei der Herstellung wertvolle Rohstoffe eingesetzt und die Geräte oftmals…

Sustainable mobile devices for the environment: Long live smartphones and tablets!

Mobility matters for people and their devices, but increasingly, so does sustainability. But smartphones, tablets, and the like generate considerable carbon emissions when they are produced and when they are used. In addition, valuable raw materials are used to make…

Weltraumelektronik – Fit für den Orbit

Der Weltraumvertrag von 1967 regelt: „Jede Nation hat freien Zugang zum All.“ Seit zirka 20 Jahren starten immer mehr Nationen mit kommerziellen Projekten in den Weltraum. Private Raumfahrtunternehmen planen, mit Mikro– und Nanosatelliten z.B. die weltweite lückenlose Internetversorgung zu erreichen….

Space Electronics – Fit for Orbit!

The Outer Space Treaty of 1967 stipulates that every nation enjoys free access to space. For the last 20 years, more and more nations have been launching commercial projects in space. Private spaceflight companies are planning to use micro and…

Robust5G – How clever module design slows down the material aging of 5G components

Communication networks like 5G need the many modules and components that make them up to be robust and long-lasting, whatever the environmental conditions or other circumstances may be. Researchers at Fraunhofer IZM have now developed a testing method which allows…

Skipping the Laboratory – Turbotesting with Lab-on-a-Chip for Point-of-Care Diagnostics

With Lab-on-a-Chip technology, testing becomes much faster and more efficient. Not only can these sensors replace reference laboratories, they can even communicate the results directly to a computer for validation and statistics. And, as our expert Manuel Bäuscher wants to…