Dr. Michael Töpper

Michael Töpper has an M.S. degree in chemistry and a Ph.D. degree in material science. Since 1994, he has been with the Packaging Research Team at TU Berlin and Fraunhofer IZM. In 1997, he became head of a research group there. In 2006, he was also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah and was teaching 10 years at TU-Berlin. The focus of his work has been wafer-level packaging applications as they relate to materials. Since 2015 he is business developer at Fraunhofer IZM. Michael Töpper is a Senior Member of IEEE-CPMT, now IEEE-EPS.


Scientists, the industry, the stock market… – in short: everyone is getting excited about chiplets. These are individual modules that, for example, add several CPU cores, graphics units, or other components of the entire chip. Dr. Michael Töpper speaks to…